adsst-sharc-melody-ultra Analog Devices, Inc., adsst-sharc-melody-ultra Datasheet - Page 24

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adsst-sharc-melody-ultra

Manufacturer Part Number
adsst-sharc-melody-ultra
Description
Sharc Melody Ultra Audio Processor
Manufacturer
Analog Devices, Inc.
ADSST-SHARC-Melody-Ultra
ENVIRONMENTAL CONDITIONS
Thermal Characteristics
The SHARC Melody Ultra is packaged in a 225-lead Mini Ball
Grid Array (MBGA). The SHARC Melody Ultra is specified for
a case temperature (T
is not exceeded, a heat sink and/or an airflow source may be
used. Use the center block of ground pins (MBGA balls: F6–10,
G6–10, H6–10, J6–10, K6–10) to provide thermal pathways to
the printed circuit board’s ground plane. A heat sink should be
attached to the ground plane with a thermal adhesive as close as
possible to the thermal pathways.
CASE
). To ensure that the T
CASE
specification
Rev. 0 | Page 24 of 28
where:
T
PD = Power dissipation in W (this value depends upon the spe-
cific application; a method for calculating PD is shown in the
Power Dissipation
θ
Table 7. Airflow over Package vs. θ
Airflow (Linear ft/min)
θ
1
θ
CA
CA
CASE
JC
T
= 6.8°C/W.
(°C/W)
= Value from
CASE
= Case temperature (measured on top surface of package)
= T
1
AMB
+ ( PD × θ
Table 7
section on page 22).
, below.
CA
)
CA
0
17.9
200
15.2
400
13.7

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