MT48H16M16LF MICRON [Micron Technology], MT48H16M16LF Datasheet - Page 5

• Manufacturer Part Number: MT48H16M16LF
• Description: 256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
• Manufacturer: MICRON [Micron Technology]

Figure 1:
General Description
PDF:09005aef8219eeeb/Source: 09005aef8219eedd
MT48H16M16LF_2.fm - Rev F 4/07 EN
256Mb Mobile SDRAM Part Numbering
The Micron
memory containing 268,435,456-bits. It is internally configured as a quad-bank DRAM
with a synchronous interface (all signals are registered on the positive edge of the clock
signal, CLK). Each of the x16’s 67,108,864-bit banks is organized as 8,192 rows by 512
columns by 16 bits. Each of the x32’s 67,108,864-bit banks is organized as 4,096 rows by
512 columns by 32 bits.
Read and write accesses to the SDRAM are burst oriented; accesses start at a selected
location and continue for a programmed number of locations in a programmed
sequence. Accesses begin with the registration of an ACTIVE command, which is then
followed by a READ or WRITE command. The address bits registered coincident with the
ACTIVE command are used to select the bank and row to be accessed. The address bits
registered coincident with the READ or WRITE command are used to select the starting
column location for the burst access.
The SDRAM provides for programmable read or write burst lengths (BLs) of 1, 2, 4, or 8
page locations with a read burst terminate option. An auto precharge function may be
enabled to provide a self-timed row precharge that is initiated at the end of the burst
sequence.
The 256Mb SDRAM uses an internal pipelined architecture to achieve high-speed opera-
tion. It also allows the column address to be changed on every clock cycle to achieve a
high-speed, fully random access. Precharging one bank while accessing one of the other
three banks will hide the precharge cycles and provide seamless high-speed, random-
access operation.
V
1.8V/1.8V
Example Part Number: MT48H8M32LFB5-75LIT
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MT48
/V
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Configuration
16 Meg x 16
8 Meg x 32
Q
®
256Mb Mobile SDRAM is a high-speed CMOS, dynamic random-access
V
V
H
BF
B5
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DD
Q
/
Package
8 x 9 VFBGA (lead-free)
8 x 13 VFBGA (lead-free)
Configuration
16M16LF
8M32LF
Mobile
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
5
Package
Micron Technology, Inc., reserves the right to change products or specifications without notice.
–
Speed
-75
-8
Power
Speed Grade
t
t
L
CK = 7.5ns
CK = 8.0ns
Temp.
Power
Standard I
Low I
I T
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Operating Temp.
Commercial
Industrial
Revision
2P/I
General Description
©2006 Micron Technology, Inc. All rights reserved.
:G Design Revision
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2P/I
7
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Revision
7