MT48H16M16LF MICRON [Micron Technology], MT48H16M16LF Datasheet - Page 71

• Manufacturer Part Number: MT48H16M16LF
• Description: 256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
• Manufacturer: MICRON [Micron Technology]

Figure 52:
PDF:09005aef8219eeeb/Source: 09005aef8219eedd
MT48H16M16LF_2.fm - Rev F 4/07 EN
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
SEATING PLANE
DIMENSIONS APPLY
TO SOLDER BALLS POST
REFLOW. THE PRE-
REFLOW DIAMETER IS
0.42 ON A 0.40 SMD
BALL PAD
11.20 ±0.10
for production devices. Although considered final, these specifications are subject to change, as further product
90X Ø0.45
0.10 A
BALL A9
5.60 ±0.05
90-Ball VFBGA (8mm x 13mm)
Notes:
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
A
0.65 ±0.05
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
1. All dimensions are in millimeters.
All other trademarks are the property of their respective owners.
3.20
development and data characterization sometimes occur.
8.00 ±0.10
6.40
C L
4.00 ±0.05
C L
6.50 ±0.05
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
0.80 TYP
BALL A1 ID
BALL A1
71
13.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
Package Dimensions
96.5% Sn, 3%Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
©2006 Micron Technology, Inc. All rights reserved.
BALL A1 ID