MT48H16M16LF MICRON [Micron Technology], MT48H16M16LF Datasheet - Page 70

• Manufacturer Part Number: MT48H16M16LF
• Description: 256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
• Manufacturer: MICRON [Micron Technology]

Package Dimensions
Figure 51:
PDF:09005aef8219eeeb/Source: 09005aef8219eedd
MT48H16M16LF_2.fm - Rev F 4/07 EN
CONDITION. THE PRE-
REFLOW DIAMETER
DIAMETER REFERS
TO POST REFLOW
IS 0.42 ON A 0.40
SMD BALL PAD.
6.40
SOLDER BALL
54X Ø0.45
SEATING
PLANE
BALL A9
0.10 A
54-Ball VFBGA (8mm x 9mm)
3.20
Notes:
A
1. All dimensions are in millimeters.
3.20
8.00 ±0.10
6.40
C L
0.80
TYP
4.00 ±0.05
C L
4.50 ±0.05
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
0.80 TYP
0.65 ±0.05
BALL A1
BALL A1 ID
70
9.00 ± 0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
MOLD COMPOUND: EPOXY NOVOLAC
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
96.5% Sn, 3% Ag, 0.5% Cu
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.
MICRON LOGO
TO BE LASED
BALL A1 ID