MC68HC05P1ADW FREESCALE [Freescale Semiconductor, Inc], MC68HC05P1ADW Datasheet - Page 97

• Manufacturer Part Number: MC68HC05P1ADW
• Description: General Release Specification
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

10.5 Thermal Characteristics
10.6 Power Considerations
MC68HC05P1A
—
Rev. 3.0
The average chip-junction temperature, T
where:
For most applications, P
The following is an approximate relationship between P
(neglecting P
Solving equations (1) and (2) for K gives:
where K is a constant pertaining to the particular part. K can be
determined from equation (3) by measuring P
known T
obtained by solving equations (1) and (2) iteratively for any value of T
Thermal Resistance
T
P
P
P
PDIP
SOIC
Freescale Semiconductor, Inc.
A
JA
D
INT
I/O
= Ambient temperature, C
For More Information On This Product,
= P
= Package thermal resistance, junction-to-ambient, C/W
= Power dissipation on input and output pins (user-determined)
= I
INT
A
DD
. Using this value of K, the values of P
+ P
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I/O
Electrical Specifications
V
Characteristic
I/O
):
K = P
DD
watts (chip internal power)
D
P
T
D
I/O
(T
J
= K + (T
= T
A
« P
+ 273 C) +
A
INT
+ (P
and can be neglected.
J
D
+ 273 C)
JA
J,
JA
)
Symbol
can be obtained in C from:
D
General Release Specification
JA
(P
at equilibrium for a
D
D
)
and T
2
Thermal Characteristics
Electrical Specifications
D
Value
J
56
71
and T
can be
J
Unit
C/W
(1)
(2)
(3)
A
.