M1AFS250-FGG256I Actel Corporation, M1AFS250-FGG256I Datasheet - Page 3

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M1AFS250-FGG256I

Manufacturer Part Number
M1AFS250-FGG256I
Description
Actel Fusion Family Of Mixed Signal Fpgas
Manufacturer
Actel Corporation
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M1AFS250-FGG256I
Manufacturer:
Microsemi SoC
Quantity:
10 000
Product Ordering Codes
Notes:
1. For Fusion devices, Quad Flat No Lead packages are only offered as RoHS compliant, QNG packages.
2. MicroBlade and Pigeon Point devices only support FG packages.
Fusion Device Status
Fusion
AFS090
AFS250
AFS600
AFS1500
M1AFS600
Part Number
Fusion Devices
_
M1AFS1500 =
P1AFS1500 =
M1AFS250 =
M1AFS600 =
ARM-Enabled Fusion Devices
Pigeon Point Devices
P1AFS600 =
MicroBlade Devices
U1AFS600 =
Production
Production
Production
Production
AFS1500 =
Status
AFS090 =
AFS250 =
AFS600 =
1
Speed Grade
Blank = Standard
90,000 System Gates
250,000 System Gates
600,000 System Gates
1,500,000 System Gates
250,000 System Gates
600,000 System Gates
1,500,000 System Gates
600,000 System Gates
1,500,000 System Gates
600,000 System Gates
FG
1 = 15% Faster than Standard
2 = 25% Faster than Standard
M1AFS1500
M1AFS250
M1AFS600
Cortex-M1
Package Type
QN = Quad Flat No Lead (0.5 mm pitch)
PQ = Plastic Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
G
Lead-Free Packaging Options
Production
Production
Production
Status
Blank = Standard Packaging
256
R e visi on 1
G = RoHS-Compliant (green) Packaging
Package Lead Count
Pigeon Point
P1AFS1500
P1AFS600
I
Application (junction temperature range)
Blank = Commercial (0 to +85°C)
PP = Pre-Production
ES = Engineering Silicon (room temperature only)
I = Industrial (–40 to +100°C)
Production
Production
1
Status
Actel Fusion Family of Mixed Signal FPGAs
2
MicroBlade
U1AFS600
Production
Status
III

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