C8051F587-IMR Silicon Labs, C8051F587-IMR Datasheet - Page 39
![no-image](/images/no-image-200.jpg)
C8051F587-IMR
Manufacturer Part Number
C8051F587-IMR
Description
8-bit Microcontrollers - MCU 50 MIPS 96 kB 8 kB SPI 2xUART
Manufacturer
Silicon Labs
Datasheet
1.C8051F585-IQR.pdf
(356 pages)
Specifications of C8051F587-IMR
Rohs
yes
Core
8051
Data Bus Width
8 bit
Processor Series
C8051
- Current page: 39 of 356
- Download datasheet (3Mb)
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
5. The stencil thickness should be 0.125mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Dimension
metal pad is to be 60m minimum, all the way around the pad.
good solder paste release.
Components.
C1
C2
E
Table 4.8. QFP-32 Landing Diagram Dimensions
8.40
8.40
Min
Figure 4.8. QFP-32 Package Drawing
0.80 BSC
Max
8.50
8.50
Rev. 1.2
Dimension
X1
Y1
C8051F58x/F59x
0.40
1.25
Min
Max
0.50
1.35
39
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