MT46H8M16LFCF-10 IT Micron Technology Inc, MT46H8M16LFCF-10 IT Datasheet - Page 60
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MT46H8M16LFCF-10 IT
Manufacturer Part Number
MT46H8M16LFCF-10 IT
Description
IC DDR SDRAM 128MBIT 60VFBGA
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Specifications of MT46H8M16LFCF-10 IT
Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
128M (8Mx16)
Speed
100MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
-40°C ~ 85°C
Package / Case
60-VFBGA
Organization
8Mx16
Density
128Mb
Address Bus
15b
Access Time (max)
7ns
Maximum Clock Rate
104MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
90mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Figure 38:
PDF: 09005aef822b7e27/Source: 09005aef822b7dd6
MT46H8M16LFB_2.fm - Rev. A 5/06 EN
Self Refresh Mode
Notes:
2. Device must be in the all banks idle state prior to entering self refresh mode.
3. NOPs or DESELECT are required for
4. AR = AUTO REFRESH command.
COMMAND
1. Clock must be stable before exiting self refresh mode. That is, the clock must be cycling
within specifications by Ta0.
ADDR
CKE
DQS
CK#
DM
CK
DQ
1
1
4
t
t
IS
IS
t
NOP
RP
T0
2
t
t
IH
IH
t
CH
t
CL
t
IS
AR
T1
Enter self refresh mode
60
t
128Mb: 8 Meg x 16 Mobile DDR SDRAM
XSR time with at least two clock pulses.
Micron Technology, Inc., reserves the right to change products or specifications without notice.
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Ta0
(1)
t CK
t IS
©2006 Micron Technology, Inc. All rights reserved.
NOP
Ta1
Exit self refresh mode
Timing Diagrams
t XSR
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3
t IS
VALID
VALID
Tb0
DON’T CARE
t IH
Advance