MT46H8M16LFCF-10 IT Micron Technology Inc, MT46H8M16LFCF-10 IT Datasheet - Page 66
![IC DDR SDRAM 128MBIT 60VFBGA](/photos/7/23/72317/mfg557-60-fbga_sml.jpg)
MT46H8M16LFCF-10 IT
Manufacturer Part Number
MT46H8M16LFCF-10 IT
Description
IC DDR SDRAM 128MBIT 60VFBGA
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Specifications of MT46H8M16LFCF-10 IT
Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
128M (8Mx16)
Speed
100MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
-40°C ~ 85°C
Package / Case
60-VFBGA
Organization
8Mx16
Density
128Mb
Address Bus
15b
Access Time (max)
7ns
Maximum Clock Rate
104MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
90mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Package Dimensions
Figure 44:
PDF: 09005aef822b7e27/Source: 09005aef822b7dd6
MT46H8M16LFB_2.fm - Rev. A 5/06 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS Ø 0.42
60X Ø 0.45
SEATING
7.20
PLANE
0.10 C
BALL A9
60-Ball VFBGA Package
Advance: This data sheet contains initial descriptions of products still under development.
3.60
Notes:
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
1. Dimensions are in millimeters.
3.20
0.80 TYP
8.00 ±0.10
6.40
C L
4.00 ±0.05
C L
their respective owners.
0.80 TYP
BALL A1
0.65 ±0.05
BALL A1 ID
5.00 ±0.05
66
10.00 ±0.10
®
128Mb: 8 Meg x 16 Mobile DDR SDRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SOLDER BALL PADS:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
PLASTIC LAMINATE
EPOXY NOVOLAC
96.5% Sn, 3% Ag, 0.5% Cu (lead-free)
Ø 0.40 SOLDER MASK DEFINED
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.
BALL A1 ID
Advance