D13002F16V Renesas Electronics America, D13002F16V Datasheet - Page 177

• Manufacturer Part Number: D13002F16V
• Description: IC H8/3002 ROMLESS 100QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13002F16V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 38
• Program Memory Type: ROMless
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Example 3: Connection to 2CAS 4-Mbit DRAM (16-Mbyte Mode): Figure 7-11 shows typical
interconnections to a single 2CAS 4-Mbit DRAM, and the corresponding address map.
Figure 7-12 shows a setup procedure to be followed by a program for this example.
The DRAM in this example has 9-bit row addresses and 9-bit column addresses. Its address area
is H'600000 to H'67FFFF.
Figure 7-11 Interconnections and Address Map for 2CAS 4-Mbit DRAM (Example)
H8/3002
H'600000
H'67FFFF
H'680000
H'7FFFFF
D
15
HWR
to D
LWR
CS
RD
A
A
A
A
A
A
A
A
A
9
8
7
6
5
4
3
2
1
3
0
DRAM area
Not used
a. Interconnections (example)
b. Address map
160
Area 3 (16-Mbyte mode)
2
row address, 9-bit column address,
and
CAS
A
A
A
A
A
A
A
A
A
RAS
UCAS
LCAS
WE
OE
I/O
8
7
6
5
4
3
2
1
0
15
16-bit organization
4-Mbit DRAM with 9-bit
to I/O
0