D13002F16V Renesas Electronics America, D13002F16V Datasheet - Page 251

IC H8/3002 ROMLESS 100QFP

D13002F16V

Manufacturer Part Number
D13002F16V
Description
IC H8/3002 ROMLESS 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of D13002F16V

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
38
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D13002F16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
8.6 Usage Notes
8.6.1 Note on Word Data Transfer
Word data cannot be accessed starting at an odd address. When word-size transfer is selected, set
even values in the memory and I/O address registers (MAR and IOAR).
8.6.2 DMAC Self-Access
The DMAC itself cannot be accessed during a DMAC cycle. DMAC registers cannot be specified
as source or destination addresses.
8.6.3 Longword Access to Memory Address Registers
A memory address register can be accessed as longword data at the MARR address.
Example
MOV.L
MOV.L
Four byte accesses are performed. Note that the CPU may release the bus between the second byte
(MARE) and third byte (MARH).
Memory address registers should be written and read only when the DMAC is halted.
8.6.4 Note on Full Address Mode Setup
Full address mode is controlled by two registers: DTCRA and DTCRB. Care must be taken to
prevent the B channel from operating in short address mode during the register setup. The enable
bits (DTE and DTME) should not be set to 1 until the end of the setup procedure.
#LBL, ER0
ER0, @MARR
235

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