WG82574L S LBA8 Intel, WG82574L S LBA8 Datasheet - Page 453

• Manufacturer Part Number: WG82574L S LBA8
• Manufacturer: Intel

Specifications of WG82574L S LBA8

• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / RoHS Status: Compliant

Thermal Design Considerations—82574 GbE Controller
14.5
14.6
Table 92.
Technology trends continue to push these parameters toward increased performance
levels (higher operating speeds), I/O density (smaller packages), and silicon density
(more transistors). Power density increases and thermal cooling solution space and
airflow become more constrained as operating frequencies increase and packaging
sizes decrease. These issues result in an increased emphasis on the following:
Packaging Terminology
The following is a list of packaging terminology used in this section:
Product Package Thermal Specification
Package Thermal Characteristics in Standard JEDEC Environment
• The component die temperature depends on the following:
• Package and thermal enhancement technology to remove heat from the device.
• System design to reduce local ambient temperatures and ensure that thermal
• Quad Flat No Leads - Plastic encapsulated package with a copper leadframe
• Junction - Refers to a P-N junction on the silicon. In this section, it is used as a
• Ambient - Refers to local ambient temperature of the bulk air approaching the
• Lands - The pads on the PCB that the BGA balls are soldered to.
• PCB - Printed Circuit Board.
• Printed Circuit Assembly (PCA) - An assembled PCB.
• Thermal Design Power (TDP) - The estimated maximum possible/expected power
• LFM - Linear Feet per Minute (airflow)
design requirements are met for each component in the system.
substrate. Package uses perimeter lands on the bottom of the package to provide
electrical contact to the PCB. This package is also known as QFN.
temperature reference point (for example, Theta JA refers to the junction to
ambient temperature).
component. It can be measured by placing a thermocouple approximately one inch
upstream from the component edge.
generated in a component by a realistic application. Use the maximum power
requirement numbers from
— Component power dissipation
— Size
— Packaging materials (effective thermal conductivity)
— Type of interconnection to the substrate and motherboard
— Presence of a thermal cooling solution
— Thermal conductivity
— Power density of the substrate/package, nearby components, and circuit board
that is attached to it
Package Type
9 mm-64 QFN
Est. Power
473 mW
(TDP)
Table
92.
39.5

JA
°
C/W
0.7

°
JT
C/W
TJ Max
120
°
C
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