WG82574L S LBA8 Intel, WG82574L S LBA8 Datasheet - Page 458

• Manufacturer Part Number: WG82574L S LBA8
• Manufacturer: Intel

Specifications of WG82574L S LBA8

• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / RoHS Status: Compliant

14.12.1
Note:
Figure 86.
14.13
458
Attaching the Thermocouple
The following approach is recommended to minimize measurement errors for attaching
the thermocouple to the case.
It is critical that the entire thermocouple lead be butted tightly to the top of the
package.
Technique for Measuring Tcase with a 0° Angle Attachment
Conclusion
Increasingly complex systems require better power dissipation. Care must be taken to
ensure that the additional power is properly dissipated. Heat can be dissipated using
improved system cooling, selective use of ducting, passive or active heat sinks, or any
combination.
The simplest and most cost effective method is to improve the inherent system cooling
characteristics through careful design and placement of fans, vents, and ducts. When
additional cooling is required, thermal enhancements may be implemented in
conjunction with enhanced system cooling. The size of the fan or heat sink can be
varied to balance size and space constraints with acoustic noise.
This section has presented the conditions and requirements to properly design a
cooling solution for systems implementing the 82574. Properly designed solutions
provide adequate cooling to maintain the 82574 case temperature at or below those
listed in
temperature and creating a minimal thermal resistance to that local ambient
temperature. Alternatively, heat sinks might be required if case temperatures exceed
those listed in
By maintaining the 82574 case temperature at or below those recommended in this
section, the 82574 will function properly and reliably.
Use this section to understand the 82574 thermal characteristics and compare them to
your system environment. Measure the 82574 case temperatures to determine the best
thermal solution for your design.
• Use 36 gauge or smaller diameter K type thermocouples.
• Ensure that the thermocouple has been properly calibrated.
• Attach the thermocouple bead or junction to the top surface of the package (case)
• Attach the thermocouple at a 0° angle if there is no interference with the
in the center of the package using high thermal conductivity cements.
thermocouple attach location or leads
is recommended for use with non-enhanced packages.
Table
93. Ideally, this is accomplished by providing a low local ambient
Table
93.
82574 GbE Controller—Thermal Design Considerations
(Figure
86). This is the preferred method and