MCZ33781EK Freescale Semiconductor, MCZ33781EK Datasheet - Page 5

• Manufacturer Part Number: MCZ33781EK
• Description: IC MASTER DSI 2.02 DIFF 32-SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MCZ33781EK

• Applications: Automotive Systems
• Interface: SPI
• Voltage - Supply: 4.75 V ~ 5.25 V
• Package / Case: 32-SOIC (7.5mm Width) Exposed Pad, 32-eSOIC, 32-HSOIC
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 2. Maximum Ratings
damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL RATINGS
THERMAL RATINGS
Notes
Supply Voltages
Maximum Voltage on Logic Input/Output Pins
Maximum Voltage on DBUS Pins
Maximum DBUS Pin Current
Maximum Logic Pin Current
ESD Voltage
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
Thermal Shutdown (Bus Drivers and Pseudo Bus Switch)
Resistance, Junction-to-Ambient
Resistance, Junction-to-Board
Soldering Reflow Temperature
Peak Package Reflow Temperature During Reflow
All voltages are with respect to GND unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
1.
2.
3.
VSUPn
Load Dump VSUPn (300ms maximum - either pin)
VCC
VDD
VPP
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
Corner pins
All other pins
ESD1 testing is performed in accordance with the Human Body Model (HBM) (C
in accordance with the Machine Model (MM) (C
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
(1)
Ratings
ELECTRICAL CHARACTERISTICS
(2)
,
(3)
ZAP
MAXIMUM RATINGS
= 200pF, R
ZAP
= 0Ω); and Charge Body Model (CBM).
V
ZAP
T
Symbol
SUP1
V
V
V
I
SOLDER
T
I
V
LOGIC
T
R
R
SUPLD
DBUS
V
V
T
V
SUP2
DBUS
PPRT
T
ESD
STG
T
θ
θ
CC
–
SD
= 100pF, R
DD
PP
A
J
JA
JB
and
ZAP
-0.3 to V
-0.3 to V
= 1500Ω); ESD2 testing is performed
ELECTRICAL CHARACTERISTICS
-0.3 to 26.5
-0.3 to 10.0
155 to 190
-0.3 to 7.0
-0.3 to 3.1
-55 to 150
-40 to 150
-40 to 90
±2000
Value
Note 3
±200
±750
±500
400
260
40
20
71
SUPn
6
CC
+ 0.3
+ 0.3
MAXIMUM RATINGS
°C/W
°C/W
Unit
mA
mA
°C
°C
°C
°C
°C
°C
V
V
V
V
33781
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