adsp-bf539bbcz-5f8 Analog Devices, Inc., adsp-bf539bbcz-5f8 Datasheet - Page 55

• Manufacturer Part Number: adsp-bf539bbcz-5f8
• Description: Blackfin Embedded Processor
• Manufacturer: Analog Devices, Inc.

THERMAL CHARACTERISTICS
To determine the junction temperature on the application
printed circuit board use
where
T
T
center of package.
Ψ
P
the method to calculate P
Values of θ
circuit board design considerations. θ
order approximation of T
where:
T
Values of θ
circuit board design considerations when an external heatsink is
required.
Values of θ
circuit board design considerations.
In
JEDEC standards JESD51-2 and JESD51-6, and the junction-to-
board measurement complies with JESD51-8. The junction-to-
case measurement complies with MIL-STD-883 (Method
1012.1). All measurements use a 2S2P JEDEC test board.
Table 36. Thermal Characteristics BC-316 Without Flash
Table 37. Thermal Characteristics BC-316 With Flash
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
D
J
CASE
A
JA
JMA
JMA
JC
JA
JMA
JMA
JC
JT
JT
JT
JT
JT
JT
JT
= Junction temperature ( C)
Table 36
= Power dissipation (see
= Ambient temperature ( C)
= From
= Case temperature ( C) measured by customer at top
JA
JC
JB
and
Table 36
are provided for package comparison and printed
are provided for package comparison and printed
are provided for package comparison and printed
Table
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
T
J
T
or
37, airflow measurements comply with
=
J
Table 37
=
T
D
J
)
CASE
by the equation:
T
Power Dissipation on Page 52
A
+
+
(
θ
(
Ψ
JA
JT
×
JA
×
P
can be used for a first
D
P
)
D
)
Typical
21.6
18.8
18.1
5.36
0.13
0.25
0.25
Typical
20.9
18.1
17.4
5.01
0.12
0.24
0.24
Rev. A | Page 55 of 60 | February 2008
Unit
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
for
ADSP-BF539/ADSP-BF539F