adsp-bf539bbcz-5f8 Analog Devices, Inc., adsp-bf539bbcz-5f8 Datasheet - Page 60

• Manufacturer Part Number: adsp-bf539bbcz-5f8
• Description: Blackfin Embedded Processor
• Manufacturer: Analog Devices, Inc.

ADSP-BF539/ADSP-BF539F
SURFACE-MOUNT DESIGN
Table 40
standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface Mount Design and Land Pattern Standard.
Table 40. BGA Data for Use with Surface-Mount Design
ORDERING GUIDE
1
2
3
©2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Model
ADSP-BF539BBCZ-5A
ADSP-BF539BBCZ-5F4
ADSP-BF539BBCZ-5F8
Package
316-Ball Chip Scale Package Ball Grid Array [CSP_BGA](BC-316) Solder Mask Defined
A similar part is available for use in specific automotive applications. Contact your local ADI sales office for the ADBF539W Automotive Data Sheet which highlights any
Referenced temperature is ambient temperature.
Z = RoHS compliant part.
specification changes and ordering information.
1
is provided as an aid to PCB design. For industry-
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3
3
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
2
D06699-0-2/08(A)
Package Description
316-Ball Chip Scale Package
Ball Grid Array [CSP_BGA]
316-Ball Chip Scale Package
Ball Grid Array [CSP_BGA]
316-Ball Chip Scale Package
Ball Grid Array [CSP_BGA]
Rev. A | Page 60 of 60 | February 2008
Ball Attach Type
Package
Option
BC-316
BC-316
BC-316
Solder Mask Opening
0.40 mm diameter
Instruction
Rate (Max)
533 MHz
533 MHz
533 MHz
Operating Voltage
(Nominal)
1.25 V internal/ 3.3 V I/O
1.25 V internal/ 3.3 V I/O
1.25 V internal/ 3.3 V I/O
Ball Pad Size
0.50 mm diameter