MPC8347 FREESCALE [Freescale Semiconductor, Inc], MPC8347 Datasheet - Page 59

• Manufacturer Part Number: MPC8347
• Description: Integrated Host Processor Hardware Specifications
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

18 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8347EA is available
in two packages a tape ball grid array (TBGA) and a plastic ball grid array (PBGA). See
“Package Parameters for the MPC8347EA
MPC8347EA
Section 18.4, “Mechanical Dimensions of the MPC8347EA
18.1
The package parameters are provided in the following list. The package type is 35 mm × 35 mm, 672 tape
ball grid array (TBGA).
Freescale Semiconductor
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
Package Parameters for the MPC8347EA TBGA
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 3
TBGA,” and
Section 18.3, “Package Parameters for the MPC8347EA
TBGA,” and
672
1.00 mm
1.46 mm
62 Sn/36 Pb/2 Ag (ZU package)
95.5 Sn/0.5 Cu/4Ag (VV package)
0.64 mm
35 mm × 35 mm
Section 18.2, “Mechanical Dimensions of the
PBGA.”
PBGA” and
Package and Pin Listings
Section 18.1,
59