MPC8347 FREESCALE [Freescale Semiconductor, Inc], MPC8347 Datasheet - Page 96

• Manufacturer Part Number: MPC8347
• Description: Integrated Host Processor Hardware Specifications
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Thermal
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following list:
96
f
MEI, 75
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
MEI, 75
MEI, 75
MEI, 75
×
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 3
Heat Sink Assuming Thermal Grease
85
Wakefield, 53
Wakefield, 53
Wakefield, 53
AAVID 30
AAVID 30
AAVID 30
AAVID 31
AAVID 31
AAVID 31
×
×
×
×
12 mm, adjacent board, 40 mm Side bypass
85
85
85
Table 67. Heat Sink and Thermal Resistance of MPC8347EA (PBGA)
×
×
×
12 no adjacent board, extrusion
12 no adjacent board, extrusion
12 no adjacent board, extrusion
×
×
×
×
×
×
30
30
30
×
×
×
35
35
35
53
53
53
×
×
×
×
×
×
9.4 mm Pin Fin
9.4 mm Pin Fin
9.4 mm Pin Fin
×
×
×
23 mm Pin Fin
23 mm Pin Fin
23 mm Pin Fin
25 mm Pin Fin
25 mm Pin Fin
25 mm Pin Fin
Natural Convection
Natural Convection
Natural Convection
Natural Convection
408-567-8082
603-224-9988
818-842-7277
Air Flow
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
Thermal Resistance
29
Freescale Semiconductor
×
29 mm PBGA
13.5
11.3
10.1
9.6
8.8
8.1
7.5
9.1
7.1
6.5
7.7
6.6
6.9