ST72F521M9T6 STMicroelectronics, ST72F521M9T6 Datasheet - Page 200

• Manufacturer Part Number: ST72F521M9T6
• Description: IC MCU 8BIT 60K FLASH 80-TQFP
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST72F521M9T6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: CAN, LINSCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 64
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 3.8 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-TQFP, 80-VQFP
• Processor Series: ST72F5x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 2048 B
• Interface Type: CAN, I2C, SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 64
• Number Of Timers: 5
• Operating Supply Voltage: 3.8 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• For Use With: 497-6453 - BOARD EVAL BASED ON ST7LNBX497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-8244; ST72F521M9T6

ST72F521, ST72521B
13.3 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages will be converted
in 2005 to lead-free technology, named ECO-
PACK
PCN CRP/04/744 "Lead-free Conversion Program
- Compliance with RoHS", issued November 18th,
2004).
■
■
Table 29. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
200/215
TQFP
ECOPACK
to the JEDEC STD-020B compliant soldering
profile.
Detailed information on the STMicroelectronic
ECOPACK
www.st.com/stonline/leadfree/,
technical Application notes covering the main
technical
conversion
AN2036).
Package
TM
(for a detailed roadmap, please refer to
TM
TM
aspects
(AN2033,
packages are qualified according
transition program is available on
NiPdAu (Nickel-palladium-Gold)
related
Plating material devices
AN2034,
with
to
lead-free
AN2035,
specific
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACK
– TQFP Pb-packages are compatible with Lead-
ible with Lead (Pb) containing soldering process
(see application note AN2034)
free soldering process, nevertheless it's the cus-
tomer's duty to verify that the Pb-packages max-
imum temperature (mentioned on the Inner box
label) is compatible with their Lead-free soldering
temperature.
Pb solder paste
Yes
TM
TQFP packages are fully compat-
Pb-free solder paste
Yes *