AT91SAM9260B-CU-999 Atmel, AT91SAM9260B-CU-999 Datasheet - Page 759

• Manufacturer Part Number: AT91SAM9260B-CU-999
• Description: IC MCU ARM9 217LFBGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM9260B-CU-999

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 180MHz
• Connectivity: EBI/EMI, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: POR, WDT
• Number Of I /o: 96
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: ROM
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 217-LFBGA
• Processor Series: AT91SAMx
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: 2-Wire, EBI, I2S, SPI, USART
• Maximum Clock Frequency: 180 MHz
• Number Of Programmable I/os: 96
• Number Of Timers: 6
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP, AT91SAM9260-EK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 4 Channel
• For Use With: AT91SAM9260-EK - KIT EVAL FOR AT91SAM9260AT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

43.2.5
43.2.5.1
43.2.6
43.2.6.1
43.2.6.2
6221I–ATARM–17-Jul-09
I/O Considerations
MCI
I/O High Drive Strength
Busy Signal of R1b Responses is Not Taken in Account
SDIO Interrupt Does Not Work With Slots Other Than A
In case of a slow memory and/or a special operation like SDRAM refresh or SDRAM bank open-
ing, a TX underrun may occur. (latency min 960 ns).
Reduce re-arbitration time between RX & TX EMACB transfers by using internal SRAM (or
another memory slave with a short access time) to transmit buffers and descriptors.
The I/O output buffer drive is too high to guarantee the timings. This is applicable to the External
Bus Interface signals and to the peripheral I/Os.
This leads to fast rise and fall time when the signals change, causing high currents to be drawn
on the power supply pins and leads to emission of high frequencies. This may affect the opera-
tion of the device and may result in the emission of radio-frequency signals, making EMC
certification difficult.
It is strongly recommended:
The busy status of the card during the response (R1b) is ignored for the commands CMD7,
CMD28, CMD29, CMD38, CMD42, CMD56. Additionally, for commands CMD42 and CMD56 a
conflict can occur on data line0 if the MCI sends data to the card while the card is still busy.The
behavior is correct for CMD12 command (STOP_TRANSFER).
None
If there is 1-bit data bus width on slots other than slot A, the SDIO interrupt cannot be captured.
The sample is made on the wrong data line.
None
1. EMACB RX FIFO write (burst 4)
2. EMACB releases the AHB bus
3. The AHB matrix can grant an another master (ARM I or D for example)
4. AHB matrix re-arbitration (finishes at least the current word/halfword/byte)
5. The AHB matrix grants the EMACB
6. The EMACB TX FIFO read (burst 4)
• to place the memories connected to the EBI as close as possible to the SAM9260 on the
• to route all the EBI signals with a series resistor, typical value 33 ohms
• to adjust the series resistor value with tools taking into account the IBIS model of the pads
PCB
and the characteristics of the wires of the PCB, in order to guarantee rise and fall times as
long as timings permit.
Problem Fix/Workaround
Problem Fix/Workaround
Problem Fix/Workaround
Problem Fix/Workaround
AT91SAM9260
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