D13002X16V Renesas Electronics America, D13002X16V Datasheet - Page 151

• Manufacturer Part Number: D13002X16V
• Description: MCU 3/5V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13002X16V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 38
• Program Memory Type: ROMless
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Figure 6-19 shows the timing when the bus right is requested by an external bus master during a
read cycle in a two-state-access area. There is a minimum interval of two states from when the
BREQ signal goes low until the bus is released.
ø
Address
bus
Data bus
(D
AS
HWR
BREQ
BACK
1
2
3
4, 5
6
15
,
to D )
RD
Low
BACK
BREQ
High
BREQ
,
LWR
0
BREQ
BREQ
signal goes low at end of CPU read cycle, releasing bus right to external bus master.
pin continues to be sampled while bus is released to external bus master.
signal goes high, ending bus-release cycle.
High
signal is sampled at rise of T state.
signal is sampled twice consecutively.
Figure 6-19 Interconnections with Memory (Example)
1
CPU cycles
Minimum 2 cycles
T
Address
1
T
1
2
2
134
3
External bus released
High-impedance
High-impedance
High-impedance
High-impedance
4
5
6
CPU cycles