D13002X16V Renesas Electronics America, D13002X16V Datasheet - Page 493

• Manufacturer Part Number: D13002X16V
• Description: MCU 3/5V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13002X16V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 38
• Program Memory Type: ROMless
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Restrictions on Usage of DMAC
To have the DMAC read RDR, be sure to select the SCI receive-data-full interrupt (RXI) as the
activation source with bits DTS2 to DTS0 in DTCR.
Restrictions in Synchronous Mode: When data transmission is performed using an external
clock source as the serial clock, an interval of at least 5 states is necessary between clearing the
TDRE bit in SSR and the start (falling edge) of the first transmit clock pulse corresponding to
each frame (figure 13-22). This interval is also necessary when performing continuous
transmission. If this condition is not satisfied, an operation error may occur.
TDRE
SCK
Note: * Make sure that t is at least 5 states.
TXD
t*
Figure 13-22 Transmission in Synchronous Mode (Example)
X0
X1
X2
X3
X4
477
X5
X6
X7
t*
Y0
Continuous transmission
Y1
Y2
Y3