D13002X16V Renesas Electronics America, D13002X16V Datasheet - Page 169

• Manufacturer Part Number: D13002X16V
• Description: MCU 3/5V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13002X16V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 38
• Program Memory Type: ROMless
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

2CAS and 2WE Modes: The CAS/WE bit in RFSHCR can select two control modes for 16-bit-
wide DRAM: one using UCAS and LCAS; the other using UW and LW. These DRAM pins
correspond to H8/3002 pins as shown in table 7-6.
Table 7-6 DRAM Pins and H8/3002 Pins
H8/3002 Pin
HWR
LWR
RD
CS
Figure 7-5 (1) shows the interface timing for 2WE DRAM. Figure 7-5 (2) shows the interface
timing for 2CAS DRAM.
ø
(
(
(
(
Note:
Address
bus
3
CS
RAS
RD
CAS
HWR
UW
LWR
LW
RFSH
AS
3
)
)
)
)
*
16-bit access
Row
Read cycle
CAS/WE = 0 (2WE mode)
UW
LW
CAS
RAS
Column
Row
Write cycle
152
Column
DRAM Pin
*
CAS/WE = 1 (2CAS mode)
UCAS
LCAS
WE
RAS
Area 3 top address
Refresh cycle