D13002X16V Renesas Electronics America, D13002X16V Datasheet - Page 153

MCU 3/5V 0K 100-TQFP

D13002X16V

Manufacturer Part Number
D13002X16V
Description
MCU 3/5V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of D13002X16V

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
38
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D13002X16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
DDR Write Timing: Data written to a data direction register (DDR) to change a CS
CS
cycle. Figure 6-21 shows the timing when the CS
output.
BRCR Write Timing: Data written to switch between A
or output takes effect starting from the T
timing when a pin is changed from generic input to A
n
ø
Address
bus
A
output to generic input, or vice versa, takes effect starting from the T
21
ø
Address
bus
CS
to A
1
23
High impedance
Figure 6-22 BRCR Write Timing
Figure 6-21 DDR Write Timing
BRCR address
T
High impedance
1
3
T
1
state of the BRCR write cycle. Figure 6-22 shows the
136
1
P8DDR address
pin is changed from generic input to CS
23
T
, A
2
T
2
23
22
, A
, or A
22
, or A
21
output.
21
T
T
3
3
output and generic input
3
state of the DDR write
n
pin from
1

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