D13002X16V Renesas Electronics America, D13002X16V Datasheet - Page 72

MCU 3/5V 0K 100-TQFP

D13002X16V

Manufacturer Part Number
D13002X16V
Description
MCU 3/5V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of D13002X16V

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
38
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D13002X16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
2.9.3 On-Chip Supporting Module Access Timing
The on-chip supporting modules are accessed in three states. The data bus is 8 or 16 bits wide,
depending on the register being accessed. Figure 2-17 shows the on-chip supporting module
access timing. Figure 2-18 indicates the pin states.
Read
access
Write
access
ø
Address bus
Internal read signal
Internal data bus
Internal write signal
Internal data bus
Figure 2-17 Access Cycle for On-Chip Supporting Modules
T state
1
55
Bus cycle
Address
T state
2
Read data
Write data
T state
3

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