D13002X16V Renesas Electronics America, D13002X16V Datasheet - Page 182

MCU 3/5V 0K 100-TQFP

D13002X16V

Manufacturer Part Number
D13002X16V
Description
MCU 3/5V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of D13002X16V

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
38
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D13002X16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Refresh Cycle Priority Order: When there are simultaneous bus requests, the priority order is:
For details see section 6.3.7, Bus Arbiter Operation.
Wait State Insertion: When bit AST3 is set to 1 in ASTCR, the wait state controller (WSC) can
insert wait states into bus cycles and refresh cycles. For details see section 6.3.5, Wait Modes.
Self-Refresh Mode: Some pseudo-static RAM devices have a self-refresh function. After the
SRFMD bit is set to 1 in RFSHCR, when a transition to software standby mode occurs, the
H8/3002’s CS
self-refresh function can be used. On exit from software standby mode, the RFSH output goes
high.
Table 7-8 shows the pin states in software standby mode. Figure 7-16 shows the signal output
timing.
Table 7-8 Pin States in Software Standby Mode (2) (PSRAME = 1, DRAME = 0)
Signal
CS
RD
HWR
LWR
RFSH
3
(High)
3
External bus master > refresh controller > DMA controller > CPU
output goes high and its RFSH output goes low so that the pseudo-static RAM
SRFMD = 0
High
High-impedance
High-impedance
High-impedance
High
Software Standby Mode
165
SRFMD = 1 (self-refresh mode)
High
High-impedance
High-impedance
High-impedance
Low
(Low)

Related parts for D13002X16V