D13002X16V Renesas Electronics America, D13002X16V Datasheet - Page 154

MCU 3/5V 0K 100-TQFP

D13002X16V

Manufacturer Part Number
D13002X16V
Description
MCU 3/5V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of D13002X16V

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
38
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D13002X16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
6.4.3
After driving the BREQ pin low, hold it low until BACK goes low. If BREQ returns to the high
level before BACK goes low, the bus arbiter may operate incorrectly.
To terminate the external-bus-released state, hold the BREQ signal high for at least three states.
If BREQ is high for too short an interval, the bus arbiter may operate incorrectly.
If contention occurs between a transition to software standby mode and a bus request from an
external bus master, the bus may be released for one state just before the transition to
software standby mode (see figure 6-23). When using software standby mode, clear the
BRLE bit to 0 in BRCR before executing the SLEEP instruction.
Figure 6-23 Contention between Bus-Released State and Software Standby Mode
BREQ Input Timing
ø
BREQ
BACK
Address
bus
strobe
Bus-released state
137
Software standby mode

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