HD6417750SF167V Renesas Electronics America, HD6417750SF167V Datasheet - Page 1056

MPU 3V 16K PB-FREE 208-QFP

HD6417750SF167V

Manufacturer Part Number
HD6417750SF167V
Description
MPU 3V 16K PB-FREE 208-QFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417750SF167V

Core Processor
SH-4
Core Size
32-Bit
Speed
167MHz
Connectivity
EBI/EMI, FIFO, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
28
Program Memory Type
ROMless
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.6 V ~ 2 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
208-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417750SF167V
Manufacturer:
INTERSIL
Quantity:
18 720
Part Number:
HD6417750SF167V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 22 Electrical Characteristics
Rev.7.00 Oct. 10, 2008 Page 970 of 1074
REJ09B0366-0700
DACKn
(SA: IO → memory)
Legend:
IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
CKIO
BANK
Precharge-sel
Address
CSn
RD/WR
RAS
CASS
DQMn
BS
CKE
D63–D0
(write)
Figure 22.29 Synchronous DRAM Auto-Precharge Write Bus Cycle: Burst
t
WDD
(RCD[1:0] = 01, TPC[2:0] = 001, TRWL[2:0] = 010)
t
t
t
t
t
Tr
CASD2
AD
CSD
RASD
DACD
Row
Row
Row
Trw
t
RASD
t
WDD
t
CASD2
t
t
t
Tc1
t
BSD
RWD
DQMD
AD
H/L
c0
d0
t
CASD2
t
t
Tc2
t
RWD
BSD
WDD
d1
Tc3
t
DACD
d2
Tc4
d3
Trwl
t
t
t
AD
DQMD
CSD
Trwl
Tpc

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