HD6417750SF167V Renesas Electronics America, HD6417750SF167V Datasheet - Page 688

MPU 3V 16K PB-FREE 208-QFP

HD6417750SF167V

Manufacturer Part Number
HD6417750SF167V
Description
MPU 3V 16K PB-FREE 208-QFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417750SF167V

Core Processor
SH-4
Core Size
32-Bit
Speed
167MHz
Connectivity
EBI/EMI, FIFO, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
28
Program Memory Type
ROMless
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.6 V ~ 2 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
208-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

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HD6417750SF167V
Manufacturer:
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Section 14 Direct Memory Access Controller (DMAC)
14.4
14.4.1
Examples of transfer of data in external memory to an external device with DACK using DMAC
channel 1 are considered here.
Table 14.10 shows the transfer conditions and the corresponding register settings.
Table 14.10 Conditions for Transfer between External Memory and an External Device
Transfer Conditions
Transfer source: external memory
Transfer source: external device with DACK
Number of transfers: 32
Transfer source address: decremented
Transfer destination address: (setting invalid)
Transfer request source: external pin (DREQ1)
edge detection
Bus mode: burst
Transfer unit: word
No interrupt request at end of transfer
Channel priority order: 2 > 0 > 1 > 3
Rev.7.00 Oct. 10, 2008 Page 602 of 1074
REJ09B0366-0700
Examples of Use
Examples of Transfer between External Memory and an External Device with
DACK
with DACK, and Corresponding Register Settings
Register
SAR1
DAR1
DMATCR1
CHCR1
DMAOR
Set Value
H'0C000000
(Accessed by DACK)
H'00000020
H'000022A5
H'00000201

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