C8051F537-IM Silicon Laboratories Inc, C8051F537-IM Datasheet - Page 38

• Manufacturer Part Number: C8051F537-IM
• Description: IC 8051 MCU 2K FLASH 20QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F53xr

Specifications of C8051F537-IM

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 16
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.25 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-QFN
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.25 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 336-1400

C8051F52x/F52xA/F53x/F53xA
38
Table 3.2. DFN-10 Package Diagram Dimensions
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to JEDEC outline MO-220, variation VEED except for
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification
Dimension
custom features D2, E2, and L, which are toleranced per supplier designation.
for Small Body Components.
aaa
bbb
ddd
eee
D2
A1
E2
L1
A
D
E
b
e
L
Figure 3.1. DFN-10 Package Diagram
0.80
0.00
0.18
1.50
2.23
0.30
0.00
Min
—
—
—
—
Rev. 1.3
3.00 BSC.
0.50 BSC.
3.00 BSC.
Nom
0.90
0.02
0.25
1.65
2.38
0.40
—
—
—
—
—
Max
1.00
0.05
0.30
1.80
2.53
0.50
0.15
0.15
0.15
0.05
0.08