C8051F537-IM Silicon Laboratories Inc, C8051F537-IM Datasheet - Page 39

• Manufacturer Part Number: C8051F537-IM
• Description: IC 8051 MCU 2K FLASH 20QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F53xr

Specifications of C8051F537-IM

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 16
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.25 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-QFN
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.25 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 336-1400

Table 3.3. DFN-10 Landing Diagram Dimensions
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter
7. A 4x1 array of 1.60 x 0.45 mm openings on 0.65 mm pitch should be used for
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
between the solder mask and the metal pad is to be 60 µm minimum, all the
way around the pad.
should be used to assure good solder paste release.
pads.
the center ground pad.
specification for Small Body Components.
Dimension
C1
X1
X2
Y1
Y2
E
Figure 3.2. DFN-10 Landing Diagram
C8051F52x/F52xA/F53x/F53xA
Rev. 1.3
2.90
0.20
1.70
0.70
2.45
Min
0.50 BSC.
Max
3.00
0.30
1.80
0.80
2.55
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