MPU-6050 INVENSENSE, MPU-6050 Datasheet - Page 43

• Manufacturer Part Number: MPU-6050
• Description: GYRO/ACCEL, 9-AXIS FUSION, PROG, I2C
• Manufacturer: INVENSENSE

Specifications of MPU-6050

• No. Of Axes: 9
• Sensor Case Style: QFN
• No. Of Pins: 24
• Supply Voltage Range: 2.5V To 3.6V
• Operating Temperature Range: -40°C To +85°C
• Interface: I2C
• Acceleration Range: ± 2g, ± 4g, ± 8g, ± 16g
• Interface Type: I2C, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

12.4 Assembly Precautions
12.4.1 Gyroscope Surface Mount Guidelines
InvenSense MEMS Gyros sense rate of rotation. In addition, gyroscopes sense mechanical stress coming
from the PCB. This PCB stress is minimized with simple design rules:
When using MEMS gyroscope components in plastic packages, package stress due to PCB mounting and
assembly could affect the output offset and its value over a wide range of temperatures. This is caused by
the mismatch between the Coefficient of Linear Thermal Expansion (CTE) of the package material and the
PCB. Care must be taken to avoid package stress due to mounting.
Traces connected to pads should be as much symmetric as possible. Symmetry and balance for pad
connection will help component self alignment and will lead to better control of solder paste reduction after
reflow.
Any material used in the surface mount assembly process of the MEMS gyroscope should be free of
restricted RoHS elements or compounds. Pb-free solders should be used for assembly.
12.4.2 Exposed Die Pad Precautions
The MPU-60X0 has very low active and standby current consumption. The exposed die pad is not required
for heat sinking, and should not be soldered to the PCB since soldering to it contributes to performance
SYMBOLS
Tout
Tin
D2
E2
D3
E3
L1
L2
L3
D
E
e
b
L
c
MPU-6000/MPU-6050 Product Specification
PCB Dimensions Table (for PCB Lay-out Diagram)
I/O Land Design Dimensions (Guidelines )
Nominal Package I/O Pad Dimensions
Pad Pitch
Pad Width
Pad Length
Pad Length
Package Width
Package Length
Exposed Pad Width
Exposed Pad Length
I/O Pad Extent Width
I/O Pad Extent Length
Land Width
Outward Extension
Inward Extension
Land Length
Land Length
DIMENSIONS IN MILLIMETERS
43 of 53
Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010
NOM
0.50
0.25
0.35
0.40
4.00
4.00
3.00
2.80
4.80
4.80
0.35
0.40
0.05
0.80
0.85