MPC8309VMAHFCA Freescale Semiconductor, MPC8309VMAHFCA Datasheet - Page 72

• Manufacturer Part Number: MPC8309VMAHFCA
• Description: 417/333/233 MP Std Tmp
• Manufacturer: Freescale Semiconductor

Specifications of MPC8309VMAHFCA

• Processor Series: MPC8309
• Core: e300c3
• Data Bus Width: 32 bit
• Data Ram Size: 512 MB
• Interface Type: USB, CAN, UART, PCI
• Maximum Clock Frequency: 417 MHz
• Number Of Programmable I/os: 56
• Operating Supply Voltage: - 0.3 V to + 1.26 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Operating Temperature Range: 0 C to + 105 C
• Processor To Be Evaluated: MPC8309
• Supply Current (max): 5 uA
• Lead Free Status / Rohs Status: Details

Thermal
24 Thermal
This section describes the thermal specifications of the MPC8309.
24.1
The following table provides the package thermal characteristics for the 369, 19  19 mm MAPBGA of
the MPC8309.
24.1.1
For the following sections, P
drivers.
24.1.2
An estimation of the chip junction temperature, T
where:
72
Junction-to-ambient natural convection
Junction-to-ambient natural convection
Junction-to-ambient (@200 ft/min)
Junction-to-ambient (@200 ft/min)
Junction-to-board
Junction-to-case
Junction-to-package top
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
1012.1).
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
T
J
Thermal Characteristics
= junction temperature (C)
Thermal Management Information
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
Characteristic
Table 64. Package Thermal Characteristics for MAPBGA
D
= (V
DD
T

J
Four-layer board (2s2p)
Four-layer board (2s2p)
I
Single-layer board (1s)
Single-layer board (1s)
= T
DD
Natural convection
A
) + P
Board type
+ (R  J
J
—
—
I/O
, can be obtained from the equation:
A
, where P

P
D
)
I/O
is the power dissipation of the I/O
Symbol
R
R
R
R
R
R

JMA
JMA
JC
JA
JA
JB
JT
Value
40
25
33
22
15
9
2
Freescale Semiconductor
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
1, 2 ,3
Eqn. 1
1, 2
1, 3
1, 3
4
5
6