PCX107AVZFU100LC E2V, PCX107AVZFU100LC Datasheet - Page 15

• Manufacturer Part Number: PCX107AVZFU100LC
• Description: IC PCI BRIDGE MEM CTRLR 503PBGA
• Manufacturer: E2V

Specifications of PCX107AVZFU100LC

• Controller Type: PCI Controller
• Interface: PCI
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 503-PBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Supply: -

6. Thermal Information
6.1
2137D–HIREL–08/05
Package Characteristics
Figure 5-4.
Table 6-1
Table 6-1.
Note:
Symbol
Rθ
Rθ
Rθ
Rθ
Rθ
Rθ
JA
JMA
JMA
JMA
JB
JC
1.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8.
5. Thermal resistance between the die and the case top surface without thermal grease.
provides the package thermal characteristics for the PC107A.
Junction temperature is a function of on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, airflow, power
dissipation of other components on the board, and board thermal resistance.
Board temperature is measured on the top surface of the board near the package.
Undervoltage
Overvoltage
Waveform
Waveform
Maximum AC Waveforms for 3.3V Signaling
FC-PBGA Package Thermal Characteristics
Characteristic
Junction-to-ambient natural convection
(Single-layer board-1s)
Junction-to-ambient natural convection
(Four-layer board-2s2p)
Junction-to-ambient (at 200 ft/min)
(Single-layer board-1s)
Junction-to-ambient (at 200 ft/min)
(Four-layer board-2s2p)
Junction-to-board
Junction-to-case
(1)
(5)
(4)
11 ns
(Min)
(Max)
4 ns
(1)(3)
(1)(3)
(1)(2)
(1)(3)
62.5 ns
(Max)
4 ns
+7.1V
–
+3.6V
0V
-3.5V
7.1V p-to-p
7.1V p-to-p
Value
< 0.1
(Min)
(Min)
30
26
25
22
20
PC107A
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
15