PCX107AVZFU100LC E2V, PCX107AVZFU100LC Datasheet - Page 19

• Manufacturer Part Number: PCX107AVZFU100LC
• Description: IC PCI BRIDGE MEM CTRLR 503PBGA
• Manufacturer: E2V

Specifications of PCX107AVZFU100LC

• Controller Type: PCI Controller
• Interface: PCI
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 503-PBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Supply: -

6.1.3
2137D–HIREL–08/05
Internal Package Conduction Resistance
For the PBGA packaging technology, the intrinsic conduction thermal resistance paths are as
follows:
Figure 6-2
mounted to a printed-circuit board.
Figure 6-2.
Note:
For this PBGA package, heat is dissipated from the component via several concurrent paths.
Heat is conducted through the silicon and may be removed to the ambient air by convection
and/or radiation. In addition, a second, parallel heat flow path exists by conduction in parallel
through the C4 bumps and the epoxy under-fill, to the plastic substrate for further convection
cooling off the edges. Then from the plastic substrate, heat is conducted via the leads/balls to
the next-level interconnect (printed-circuit board) whereupon the primary mode of heat transfer
is by convection and/or radiation.
• The die junction-to-case thermal resistance,
• The die junction-to-ball thermal resistance.
The internal versus external package resistance
External Re sistance
External Resistance
Internal Resistance
depicts the primary heat transfer path for a package with an attached heat sink
C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Printed-Circuit Board
Heat Sink
Radiation
Radiation
Convection
Convection
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
PC107A
19