PCX107AVZFU100LC E2V, PCX107AVZFU100LC Datasheet - Page 40

• Manufacturer Part Number: PCX107AVZFU100LC
• Description: IC PCI BRIDGE MEM CTRLR 503PBGA
• Manufacturer: E2V

Specifications of PCX107AVZFU100LC

• Controller Type: PCI Controller
• Interface: PCI
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 503-PBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Supply: -

Notes:
9. Package Mechanical Data
9.1
Table 9-1.
40
Parameter
Package Outline
Interconnects
Pitch
Solder Attach
Solder Balls
Solder Balls Diameter
Maximum Module Height
Co-planarity Specification
Maximum Force
1. PLL_CFG[0–3] settings not listed (00000100, 0110, 0111, 1010, 1011, and 1110) are reserved.
2. In PLL Bypass mode, the PCI_SYNC_IN input signal clocks the internal core directly, the PLL is disabled, and the PCI: core
3. In Clock Off mode, no clocking occurs inside the PC107A regardless of the PCI_SYNC_IN input.
4. Limited due to maximum memory VCO = 200 MHz.
5. Limited due to minimum VCO = 100 MHz.
6. Range values are shown rounded down to the nearest whole number (decimal place accuracy removed) for clarity.
7. Limited by maximum memory bus speed.
Package Parameters
PC107A
mode is set for 1:1 mode operation. The AC timing specifications given in this document do not apply in PLL Bypass mode.
Package Parameters
The PC107A uses a 33 mm × 33 mm, 503 pin Plastic Ball Grid Array (PBGA) or HiTCE "Ceramic
Ball Grid Array (CBGA)" package. The plastic package parameters are as provided in the follow-
ing list.
HiTCE-CBGA
33 mm × 33 mm
503
1.27 mm
10 Sn/90 Pb
10 Sn/90 Pb
0.60 mm – 0.90 mm
3.20
0.20 mm
6.0 lbs. total, uniformly distributed over
package (5.4 grams/ball)
FC-PBGA
33 mm × 33 mm
503
1.27 mm
62 Sn/36 Pb/2 Ag
62 Sn/36 Pb/2 Ag
0.60 mm – 0.90 mm
2.75 mm
0.20 mm
6.0 pbs. total, uniformly distributed over
package (5.4 grams/ball)
2137D–HIREL–08/05