N25Q064A13EF640F Micron Technology Inc, N25Q064A13EF640F Datasheet - Page 142

• Manufacturer Part Number: N25Q064A13EF640F
• Manufacturer: Micron Technology Inc

Specifications of N25Q064A13EF640F

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Package mechanical
15
Table 33.
142/150
Max
mm
Typ 0.85
Min 0.80
A
1
0.05
A1
—
Package mechanical
In order to meet environmental requirements, Numonyx offers these devices in RoHS
compliant packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
Figure 110. VDFPN8 (MLP8) Very Thin Pitch Dual Flat Package, No Leads, 6×5 mm
1. Drawing is not to scale.
2. The circle in the top view of the package indicates the position of pin 1.
VDFPN8 (MLP8) Very Thin Dual Flat Package No Leads 6×5 mm Dimensions
0
0.65 0.20 0.40
A2
—
—
B
E
A3
A
—
—
E1
Drawing
2x
0.35
0.48
0.10 C B
A1
R1
b
A3
A
—
—
D
6
0.10 C A
5.75 3.40
D1
—
—
3.60
3.20
D1
D2
D
—
—
Symbol
E
5
Micron Technology, Inc., reserves the right to change products or specifications without notice.
θ
4.75
E1
—
—
E2
A2
aaa C A
3.80
4.30
C
E2
4
ddd
1.27 0.10 0.60
L
—
—
e
D2
R1
—
0
©2010 Micron Technology, Inc. All rights reserved.
0.50
0.75 12° 0.15 0.10 0.05
L
—
—
Q
e
b
aaa bbb ddd
N25Q064 - 3 V
—
—
70-ME
—
—
—
—