LPC2926_27_29 NXP Semiconductors, LPC2926_27_29 Datasheet - Page 95

• Manufacturer Part Number: LPC2926_27_29
• Description: The LPC2926/2927/2929 combine an ARM968E-S CPU core with two integrated TCMblocks operating at frequencies of up to 125 MHz, Full-speed USB 2
• Manufacturer: NXP Semiconductors

NXP Semiconductors
6.15.6.2
6.15.7
6.15.7.1
6.15.7.2
6.16
6.16.1
6.16.2
6.16.2.1
6.16.2.2
6.16.2.3
6.16.3
6.16.3.1
6.16.4
6.16.4.1
6.16.4.2
6.16.5
6.16.5.1
6.17
6.17.1
6.17.2
7
8
8.1
8.2
9
9.1
9.2
9.3
9.4
9.5
9.6
9.7
10
10.1
10.2
10.3
10.4
10.5
11
12
12.1
12.2
12.3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 61
Static characteristics. . . . . . . . . . . . . . . . . . . . 63
Dynamic characteristics . . . . . . . . . . . . . . . . . 72
Application information. . . . . . . . . . . . . . . . . . 80
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 86
Soldering of SMD packages . . . . . . . . . . . . . . 87
Power, Clock and Reset Control Subsystem
(PCRSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Dynamic characteristics: I/O and
CLK_OUT pins, internal clock, oscillators,
PLL, and CAN. . . . . . . . . . . . . . . . . . . . . . . . . 72
Dynamic characteristics: I
Dynamic characteristics: flash memory and
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Dynamic characteristics: external static
memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
(PCB) layout guidelines . . . . . . . . . . . . . . . . . 85
Wave and reflow soldering . . . . . . . . . . . . . . . 87
Clock description . . . . . . . . . . . . . . . . . . . . . . 47
Quadrature Encoder Interface (QEI) . . . . . . . 47
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 48
Clock description . . . . . . . . . . . . . . . . . . . . . . 48
Clock description . . . . . . . . . . . . . . . . . . . . . . 49
Clock Generation Unit (CGU0) . . . . . . . . . . . . 50
Functional description. . . . . . . . . . . . . . . . . . . 50
PLL functional description . . . . . . . . . . . . . . . 53
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 54
Clock generation for USB (CGU1) . . . . . . . . . 55
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 55
Reset Generation Unit (RGU). . . . . . . . . . . . . 55
Functional description. . . . . . . . . . . . . . . . . . . 56
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 57
Power Management Unit (PMU). . . . . . . . . . . 57
Functional description. . . . . . . . . . . . . . . . . . . 57
Vectored Interrupt Controller (VIC) . . . . . . . . . 59
Functional description. . . . . . . . . . . . . . . . . . . 60
Clock description . . . . . . . . . . . . . . . . . . . . . . 60
Power consumption . . . . . . . . . . . . . . . . . . . . 68
Electrical pin characteristics . . . . . . . . . . . . . . 69
USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 74
Dynamic characteristics: SPI . . . . . . . . . . . . . 76
Dynamic characteristics: ADC . . . . . . . . . . . . 80
Operating frequency selection . . . . . . . . . . . . 80
Suggested USB interface solutions . . . . . . . . 82
SPI signal forms . . . . . . . . . . . . . . . . . . . . . . . 84
XIN_OSC input . . . . . . . . . . . . . . . . . . . . . . . . 85
XIN_OSC Printed Circuit Board
Introduction to soldering . . . . . . . . . . . . . . . . . 87
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 87
2
C-bus interface. . . 75
12.4
13
14
15
16
16.1
16.2
16.3
16.4
17
18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
ARM9 microcontroller with CAN, LIN, and USB
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 90
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Revision history . . . . . . . . . . . . . . . . . . . . . . . 91
Legal information . . . . . . . . . . . . . . . . . . . . . . 92
Contact information . . . . . . . . . . . . . . . . . . . . 93
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 88
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 92
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 93
LPC2926/2927/2929
Document identifier: LPC2926_27_29
Date of release: 28 September 2010
All rights reserved.