CM68HC05C4ACFB Motorola / Freescale Semiconductor, CM68HC05C4ACFB Datasheet - Page 131
![no-image](/images/no-image-200.jpg)
CM68HC05C4ACFB
Manufacturer Part Number
CM68HC05C4ACFB
Description
Microcontroller
Manufacturer
Motorola / Freescale Semiconductor
Datasheet
1.CM68HC05C4ACFB.pdf
(156 pages)
- Current page: 131 of 156
- Download datasheet (649Kb)
General Release Specification — MC68HC05C4A
14.1 Contents
14.2 Introduction
MC68HC05C4A
MOTOROLA
—
Rev. 4.0
14.2
14.3
14.4
14.5
14.6
This section describes the dimensions of the dual in-line package (DIP),
plastic shrink dual in-line package (SDIP), plastic leaded chip carrier
(PLCC), and quad flat pack (QFP) MCU packages. Package dimensions
available at the time of this publication are provided in this section. To
make sure that you have the latest case outline specifications, contact
one of the following:
Follow Mfax or wwweb on-line instructions to retrieve the current
mechanical specifications.
•
•
•
Local Motorola Sales Office
Motorola Mfax
– Phone 602-244-6609
– EMAIL rmfax0@email.sps.mot.com
Worldwide Web (wwweb) at http://design-net.com
Introduction .............................................................................131
40-Pin Plastic Dual In-Line (DIP) Package
42-Pin Plastic Shrink Dual In-Line (SDIP) Package
44-Lead Plastic Leaded Chip Carrier (PLCC)
44-Lead Quad Flat Pack (QFP) (Case 824A-01)....................134
Section 14. Mechanical Specifications
(Case 711-03)....................................................................132
(Case 858-01)....................................................................132
(Case 777-02)....................................................................133
Mechanical Specifications
General Release Specification
131
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