FW912 Micron Semiconductor Products, FW912 Datasheet - Page 50

• Manufacturer Part Number: FW912
• Description: Flash Memory Technology
• Manufacturer: Micron Semiconductor Products

NOTE: 1. All dimensions in millimeters.
DATA SHEET DESIGNATION
Advance: This data sheet contains initial descriptions of products still under development.
4 Meg x 16 Async/Page/Burst Flash Memory
MT28F642D18_3.p65 – Rev. 3, Pub. 8/02
12.00 ± 0.10
SEATING PLANE
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE
PRE-REFLOW DIAMETER
IS Ø 0.33
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron and the M logo are registered trademarks and the Micron logo is a trademark of Micron Technology, Inc.
59X Ø
6.00 ±0.05
0.35 TYP
BALL A8
0.10 C
2.25 ±0.05
0.80 ±0.075
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
C L
2.625 ±0.05
0.75
TYP
8.00 ±0.10
5.25
C L
4.00 ±0.05
59- BALL FBGA
1.50 (4X)
ASYNC/PAGE/BURST FLASH MEMORY
SUPPORT BALLS
(4X)
0.75
TYP
4.50
BALL A1
50
BALL #1 ID
1.20 MAX
Micron Technology, Inc., reserves the right to change products or specifications without notice.
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 37% Pb, 2%Ag
SOLDER BALL PAD: Ø .27mm
SUBSTRATE: PLASTIC LAMINATE
ENCAPSULATION MATERIAL: EPOXY NOVOLAC
BALL #1 ID
4 MEG x 16
©2002, Micron Technology, Inc.
ADVANCE