sc3200 Advanced Micro Devices, sc3200 Datasheet - Page 392

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sc3200

Manufacturer Part Number
sc3200
Description
Geode-tm Sc3200 Processor
Manufacturer
Advanced Micro Devices
Datasheet

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Note 1. See the timing measurement conditions in Figure 9-16.
Note 2. Minimum times are evaluated with same load used for slew rate measurement (as shown in note 3 of Table ); max-
Note 3. Not 100% tested.
Note 4. See the timing measurement conditions in Figure 9-17.
Note 5. PCIRST# is asserted and de-asserted asynchronously with respect to PCICLK (see Figure 9-18).
Note 6. All output drivers are asynchronously floated when PCIRST# is active.
392
Symbol
t
t
t
t
t
t
t
t
t
t
VAL
VAL
ON
OFF
SU
SU
H
RST
RST-CLK
RST-OFF
Output
Buffer
(ptp)
(ptp)
imum times are evaluated with the load circuits shown in Figure 9-15, for high-going and low-going edges respec-
tively.
Pin
Parameter
PCICLK to signal valid delay (on the bus)
PCICLK to signal valid delay (GNT#)
Float to active delay
Active to float delay
Input setup time to PCICLK (on the bus)
Input setup time to PCICLK (REQ#)
Input hold time from PCICLK
PCIRST# active time after power stable
PCIRST# active time after PCICLK stable
PCIRST# active to output float delay
t
VAL
25
(Max) Rising Edge
Revision 5.1
Figure 9-15. Load Circuits for Maximum Time Measurements
0.5" max.
10 pF
Table 9-19. PCI Timing Parameters
Output
Buffer
Min
100
2
2
2
7
6
0
1
AMD Geode™ SC3200 Processor Data Book
t
VAL
Max
10 pF
28
40
11
9
(Max) Falling Edge
0.5" max.
Unit
ms
ns
ns
ns
ns
ns
ns
ns
µs
ns
Electrical Specifications
25
Comments
Note 1, Note 3,
Note 1, Note 3,
Note 4
Note 4
Note 4
Note 3, Note 5
Note 3, Note 5
Note 3, Note 5,
Note 6
Note 1, Note 2
Note 1, Note 2
V
CC

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