sc3200 Advanced Micro Devices, sc3200 Datasheet - Page 441

• Manufacturer Part Number: sc3200
• Description: Geode-tm Sc3200 Processor
• Manufacturer: Advanced Micro Devices

Package Specifications
10.2
The figures in this section provide the mechanical package outlines for the 432-Terminal EBGA (Enhanced Ball Grid Array)
and 481-Terminal TEPBGA (Thermally Enhanced Ball Grid Array) packages.
NOTES: UNLESS OTHERWISE SPECIFIED.
1)
2)
3)
4)
5)
AMD Geode™ SC3200 Processor Data Book
EBGA WITH LEAD (PB):
a) SOLDER BALL COMPOSITION: SN 63%, PB 37%.
b) SOLDERING PROFILE: 220
EBGA LEAD (PB) FREE:
a) SOLDER BALL COMPOSITION: SN 96.5%, AG 3.5%.
b) SOLDERING PROFILE: 260
DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N.
REFERENCE JEDEC REGISTRATION MO-151, VARIATION -1.00, DATED JUNE 1997.
THETA JUNCTION TO CASE (T
Figure 10-2. 432-Terminal EBGA Package (Body Size: 40x40x1.72 mm; Pitch: 1.27 mm)
Physical Dimensions
o
o
JC
C.
C
) = 1°C/WATT.
Revision 5.1
441