TRK-USB-MPC5643L Freescale Semiconductor, TRK-USB-MPC5643L Datasheet - Page 78

• Manufacturer Part Number: TRK-USB-MPC5643L
• Description: Development Boards & Kits - Other Processors StarTrakMiniUSG MPC5643L
• Manufacturer: Freescale Semiconductor

Specifications of TRK-USB-MPC5643L

• Rohs: yes
• Product: Starter Kits
• Tool Is For Evaluation Of: MPC5643L
• Core: Five Stage Pipeline
• Interface Type: LIN, DSPI
• Operating Supply Voltage: 3 V to 3.6 V
• Data Bus Width: 32 bit, 64 bit
• Description/function: Starter Kit for MPC5643L
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• For Use With: MPC5643L

Electrical characteristics
3.4
78
1
2
3
4
1
2
3
4
5
V
V
R
R
R
R
DD_LV_REGCOR
V
SS_LV_REGCOR
V

Full functionality cannot be guaranteed when voltage drops below 3.0 V. In particular, ADC electrical characteristics
and I/Os DC electrical specification may not be guaranteed.
V
voltage source.
Can be connected to emitter of external NPN. Low voltage supplies are not under user control. They are produced
by an on-chip voltage regulator.
For the device to function properly, the low voltage grounds (V
(V
is used.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
JMA
Symbol
V
V
JA
JB
JC
DD_LV_CORx
SS_LV_CORx
DD_HV_ADR0
JT
DD_LV_PLL
SS_LV_PLL
SS_HV_xxx
Thermal characteristics
Symbol
T
T
A
J
D
D
D
D
D
3
Thermal resistance, junction-to-ambient natural
convection
Thermal resistance, junction-to-ambient forced
convection at 200 ft/min
Thermal resistance junction-to-board
Thermal resistance junction-to-case
Junction-to-package-top natural convection
2
) and the low voltage supply pins (V
2
3
4
and V
3
SR Internal supply voltage
SR Internal reference voltage
SR Internal supply voltage
SR Internal reference voltage
SR Internal supply voltage
SR Internal reference voltage
SR Ambient temperature under bias
SR Junction temperature under bias
Table 9. Recommended operating conditions (3.3 V) (continued)
DD_HV_ADR1
Table 10. Thermal characteristics for 100 LQFP package
2
Parameter
MPC5643L Microcontroller Data Sheet, Rev. 8.1
cannot be operated at different voltages, and need to be supplied by the same
Parameter
DD_LV_xxx
4
3
5
) must be connected to the external ballast emitter, if one
Single layer board – 1s
Four layer board – 2s2p
Single layer board – 1s
Four layer board – 2s2p
SS_LV_xxx
f
CPU
) must be shorted to high voltage grounds
Conditions
Conditions
 120 MHz
—
—
—
—
—
—
—
—
—
—
1
Min
–40
–40
—
—
—
0
0
0
1
Freescale Semiconductor
Value Unit
Max
125
150
—
—
—
46
34
36
28
19
0
0
0
8
2
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
V
V
V
V
V
V