TRK-USB-MPC5643L Freescale Semiconductor, TRK-USB-MPC5643L Datasheet - Page 79

• Manufacturer Part Number: TRK-USB-MPC5643L
• Description: Development Boards & Kits - Other Processors StarTrakMiniUSG MPC5643L
• Manufacturer: Freescale Semiconductor

Specifications of TRK-USB-MPC5643L

• Rohs: yes
• Product: Starter Kits
• Tool Is For Evaluation Of: MPC5643L
• Core: Five Stage Pipeline
• Interface Type: LIN, DSPI
• Operating Supply Voltage: 3 V to 3.6 V
• Data Bus Width: 32 bit, 64 bit
• Description/function: Starter Kit for MPC5643L
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• For Use With: MPC5643L

Freescale Semiconductor
1
2
3
4
5
1
2
3
4
5
R
R
R
R
R
R
R
R


Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
JMA
JMA
Symbol
Symbol
JA
JB
JC
JA
JB
JC
JT
JT
D
D
D
D
D
D
D
D
D
D
Thermal resistance, junction-to-ambient natural
convection
Thermal resistance, junction-to-ambient forced
convection at 200 ft/min
Thermal resistance junction-to-board
Thermal resistance junction-to-case
Junction-to-package-top natural convection
Thermal resistance junction-to-ambient natural
convection
Thermal resistance, junction-to-ambient forced
convection at 200 ft/min
Thermal resistance junction-to-board
Thermal resistance junction-to-case
Junction-to-package-top natural convection
Table 12. Thermal characteristics for 257 MAPBGA package
Table 11. Thermal characteristics for 144 LQFP package
2
2
Parameter
Parameter
MPC5643L Microcontroller Data Sheet, Rev. 8.1
4
4
3
3
5
5
Single layer board – 1s
Four layer board – 2s2p
Single layer board – 1s
Four layer board – 2s2p
Single layer board – 1s
Four layer board – 2s2p
Single layer board – 1s
Four layer board – 2s2p
Conditions
Conditions
—
—
—
—
—
—
1
1
Electrical characteristics
Value Unit
Value Unit
44
36
35
30
24
46
26
37
22
13
8
2
8
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
79