MPC8313E-RDB Freescale Semiconductor, MPC8313E-RDB Datasheet - Page 63

• Manufacturer Part Number: MPC8313E-RDB
• Description: BOARD PROCESSOR
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II™ PROr
• Type: MCUr

Specifications of MPC8313E-RDB

• Contents: Reference Design Board, Software and Documentation
• Termination Type: SMD
• Supply Voltage Max: 1.05V
• Tool / Board Applications: Wired Connectivity-LIN, CAN, Ethernet, USB
• Mcu Supported Families: POWERQUICC II PRO
• Rohs Compliant: Yes
• Filter Terminals: SMD
• Silicon Manufacturer: Freescale
• Silicon Core Number: MPC83xx
• Kit Application Type: Communication & Networking
• Application Sub Type: Ethernet
• Core Architecture: Power Architecture
• Silicon Family Name: PowerQUICC II PRO
• For Use With/related Products: MPC8313E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 55
19 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8313E is available in
a thermally enhanced plastic ball grid array (TEPBGAII), see
MPC8313E TEPBGAII,”
information on the TEPBGAII.
19.1
The package parameters are as provided in the following list. The package type is 27 mm × 27 mm,
516 TEPBGAII.
Freescale Semiconductor
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
SPICLK (Output)
Package Parameters for the MPC8313E TEPBGAII
shows the SPI timing in master mode (internal clock).
Output Signals:
Note: The clock edge is selectable on SPI.
Input Signals:
(See Note)
(See Note)
SPIMISO
SPIMOSI
MPC8313E PowerQUICC
Figure 55. SPI AC Timing in Master Mode (Internal Clock) Diagram
and
Section 19.2, “Mechanical Dimensions of the MPC8313E TEPBGAII,”
t
NIIVKH
™
II Pro Processor Hardware Specifications, Rev. 3
t
NIKHOV
t
NIIXKH
27 mm × 27 mm
516
1.00 mm
2.25 mm
95.5 Sn/0.5 Cu/4 Ag (VR package),
62 Sn/36 Pb/2 Ag (ZQ package)
0.6 mm
Section 19.1, “Package Parameters for the
Package and Pin Listings
for
63