MC56F8367VPYE Freescale Semiconductor, MC56F8367VPYE Datasheet - Page 10

IC DSP 16BIT 60MHZ 160-LQFP

MC56F8367VPYE

Manufacturer Part Number
MC56F8367VPYE
Description
IC DSP 16BIT 60MHZ 160-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheets

Specifications of MC56F8367VPYE

Core Processor
56800
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
76
Program Memory Size
544KB (272K x 16)
Program Memory Type
FLASH
Ram Size
18K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
160-LQFP
Cpu Family
56F8xxx
Device Core Size
16b
Frequency (max)
60MHz
Interface Type
CAN/SCI/SPI
Total Internal Ram Size
36KB
# I/os (max)
76
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
4(4-chx12-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
160
Package Type
LQFP
Data Bus Width
16 bit
Processor Series
MC56F83xx
Core
56800E
Numeric And Arithmetic Format
Fixed-Point
Device Million Instructions Per Second
60 MIPs
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
76
Data Ram Size
36 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MC56F8367EVME
Minimum Operating Temperature
- 40 C
Package
160LQFP
Family Name
56F8xxx
Maximum Speed
60 MHz
Number Of Timers
4
For Use With
MC56F8367EVME - EVAL BOARD FOR MC56F83X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

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Part Number
Manufacturer
Quantity
Price
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MC56F8367VPYE
Manufacturer:
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Part Number:
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Manufacturer:
Freescale Semiconductor
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1.4 Architecture Block Diagram
Note: Features in italics are NOT available in the 56F8167 device and are shaded in the following figures.
The 56F8367/56F8167 architecture is shown in
Figure 1-1
and
Figure
1-2.
Figure 1-1
illustrates how the
56800E system buses communicate with internal memories, the external memory interface and the IPBus
Bridge.
Table 1-2
lists the internal buses in the 56800E architecture and provides a brief description of
their function.
Figure 1-2
shows the peripherals and control blocks connected to the IPBus Bridge. The
figures do not show the on-board regulator and power and ground signals. They also do not show the
multiplexing between peripherals or the dedicated GPIOs. Please see
Part 2, Signal/Connection
Descriptions,
to see which signals are multiplexed with those of other peripherals.
Also shown in
Figure 1-2
are connections between the PWM, Timer C and ADC blocks. These
connections allow the PWM and/or Timer C to control the timing of the start of ADC conversions. The
Timer C channel indicated can generate periodic start (SYNC) signals to the ADC to start its conversions.
In another operating mode, the PWM load interrupt (SYNC output) signal is routed internally to the Timer
C input channel as indicated. The timer can then be used to introduce a controllable delay before
generating its output signal. The timer output then triggers the ADC. To fully understand this interaction,
please see the 56F8300 Peripheral User Manual for clarification on the operation of all three of these
peripherals.
56F8367 Technical Data, Rev. 9
10
Freescale Semiconductor
Preliminary

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