MC56F8367VPYE Freescale Semiconductor, MC56F8367VPYE Datasheet - Page 38

IC DSP 16BIT 60MHZ 160-LQFP

MC56F8367VPYE

Manufacturer Part Number
MC56F8367VPYE
Description
IC DSP 16BIT 60MHZ 160-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheets

Specifications of MC56F8367VPYE

Core Processor
56800
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
76
Program Memory Size
544KB (272K x 16)
Program Memory Type
FLASH
Ram Size
18K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
160-LQFP
Cpu Family
56F8xxx
Device Core Size
16b
Frequency (max)
60MHz
Interface Type
CAN/SCI/SPI
Total Internal Ram Size
36KB
# I/os (max)
76
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
4(4-chx12-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
160
Package Type
LQFP
Data Bus Width
16 bit
Processor Series
MC56F83xx
Core
56800E
Numeric And Arithmetic Format
Fixed-Point
Device Million Instructions Per Second
60 MIPs
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
76
Data Ram Size
36 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MC56F8367EVME
Minimum Operating Temperature
- 40 C
Package
160LQFP
Family Name
56F8xxx
Maximum Speed
60 MHz
Number Of Timers
4
For Use With
MC56F8367EVME - EVAL BOARD FOR MC56F83X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC56F8367VPYE
Manufacturer:
AM
Quantity:
90
Part Number:
MC56F8367VPYE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC56F8367VPYE
Manufacturer:
FREESCALE
Quantity:
20 000
38
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
EMI_MODE
EXTBOOT
Signal
Name
No.
124
159
Pin
Ball No.
B11
B2
Schmitt
Schmitt
Type
Input
Input
56F8367 Technical Data, Rev. 9
enabled
enabled
During
pull-up
pull-up
Reset
State
Input,
Input,
External Boot — This input is tied to V
boot from off-chip memory (assuming that the on-chip Flash
memory is not in a secure state). Otherwise, it is tied to ground.
For details, see
Note: When this pin is tied low, the customer boot software
should disable the internal pull-up resistor by setting the XBOOT
bit of the SIM_PUDR; see
External Memory Mode — This input is tied to V
enable an extra four address lines, for a total of 20 address lines
out of reset. This function is also affected by EXTBOOT and the
Flash security mode. For details, see
If a 20-bit address bus is not desired, then this pin is tied to
ground.
Note: When this pin is tied low, the customer boot software
should disable the internal pull-up resistor by setting the
EMI_MODE bit of the SIM_PUDR; see
Table
4-4.
Signal Description
Part
6.5.6.
Table
DD
Part
Freescale Semiconductor
to force the device to
4-4.
6.5.6.
DD
in order to
Preliminary

Related parts for MC56F8367VPYE