MC56F8367VPYE Freescale Semiconductor, MC56F8367VPYE Datasheet - Page 176

• Manufacturer Part Number: MC56F8367VPYE
• Description: IC DSP 16BIT 60MHZ 160-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8367VPYE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 76
• Program Memory Size: 544KB (272K x 16)
• Program Memory Type: FLASH
• Ram Size: 18K x 16
• Voltage - Supply (vcc/vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 160-LQFP
• Cpu Family: 56F8xxx
• Device Core Size: 16b
• Frequency (max): 60MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 36KB
• # I/os (max): 76
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 4(4-chx12-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 160
• Package Type: LQFP
• Data Bus Width: 16 bit
• Processor Series: MC56F83xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 60 MIPs
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 76
• Data Ram Size: 36 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MC56F8367EVME
• Minimum Operating Temperature: - 40 C
• Package: 160LQFP
• Family Name: 56F8xxx
• Maximum Speed: 60 MHz
• Number Of Timers: 4
• For Use With: MC56F8367EVME - EVAL BOARD FOR MC56F83X
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

176
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6
SEATING
PLANE
C
DETAIL F
Figure 11-5 160-pin LQFP Mechanical Information
D
2
D1
156X
4X
θ2
θ3
2
S
D
e/2
e
(L1)
DETAIL F
D1
D
L
θ1
R1
56F8367 Technical Data, Rev. 9
R2
θ
H
G G
GAGE
PLANE
160X
0.25
4X
160X
0.08
e
0.20
0.20
M
H
0.08 C
C
C
A-B
A-B
A-B
D
D
D
NOTES:
1.
2.
3.
4.
5.
6.
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
DATUMS A, B, AND D TO BE DETERMINED
WHERE THE LEADS EXIT THE PLASTIC BODY
AT DATUM PLANE H.
DIMENSIONS D1 AND E1 DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25mm PER SIDE.
DIMENSIONS D1 AND E1 ARE MAXIMUM
PLASTIC BODY SIZE DIMENSIONS
INCLUDING MOLD MISMATCH.
DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED THE MAXIMUM b
DIMENSION BY MORE THAN 0.08mm.
DAMBAR CAN NOT BE LOCATED ON THE
LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN A PROTRUSION AND AN
ADJACENT LEAD IS 0.07mm.
EXACT SHAPE OF CORNERS MAY VARY.
DIM MIN
A1
A2
D1
R1
R2
θ
θ
θ
b1
E1
L1
c1
A
D
E
L
b
c
e
S
θ
1
2
3
SECTION G-G
MILLIMETERS
0.05
1.35
0.17
0.17
0.09
0.09
0.45
0.08
0.08
0.20
11
11
26.00 BSC
24.00 BSC
26.00 BSC
24.00 BSC
0.50 BSC
1.00 REF
---
0
0
°
°
°
°
(b)
b
MAX
1.60
0.15
1.45
0.27
0.23
0.20
0.16
0.75
0.20
13
13
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7
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Freescale Semiconductor
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°
°
Preliminary