MC56F8367VPYE Freescale Semiconductor, MC56F8367VPYE Datasheet - Page 18

IC DSP 16BIT 60MHZ 160-LQFP

MC56F8367VPYE

Manufacturer Part Number
MC56F8367VPYE
Description
IC DSP 16BIT 60MHZ 160-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheets

Specifications of MC56F8367VPYE

Core Processor
56800
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
76
Program Memory Size
544KB (272K x 16)
Program Memory Type
FLASH
Ram Size
18K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
160-LQFP
Cpu Family
56F8xxx
Device Core Size
16b
Frequency (max)
60MHz
Interface Type
CAN/SCI/SPI
Total Internal Ram Size
36KB
# I/os (max)
76
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
4(4-chx12-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
160
Package Type
LQFP
Data Bus Width
16 bit
Processor Series
MC56F83xx
Core
56800E
Numeric And Arithmetic Format
Fixed-Point
Device Million Instructions Per Second
60 MIPs
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
76
Data Ram Size
36 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MC56F8367EVME
Minimum Operating Temperature
- 40 C
Package
160LQFP
Family Name
56F8xxx
Maximum Speed
60 MHz
Number Of Timers
4
For Use With
MC56F8367EVME - EVAL BOARD FOR MC56F83X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

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Manufacturer
Quantity
Price
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Manufacturer:
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2.2 Signal Pins
After reset, each pin is configured for its primary function (listed first). Any alternate functionality must
be programmed.
Note: Signals in italics are NOT available in the 56F8167 device.
Note: The 160 Map Ball Grid Array is not available in the 56F8167 device.
If the “State During Reset” lists more than one state for a pin, the first state is the actual reset state. Other
states show the reset condition of the alternate function, which you get if the alternate pin function is
selected without changing the configuration of the alternate peripheral. For example, the A8/GPIOA0 pin
shows that it is tri-stated during reset. If the GPIOA_PER is changed to select the GPIO function of the
pin, it will become an input if no other registers are changed.
Note: LQFP Pin numbers and MBGA Ball numbers do not always correlate in Table 2-2. Please contact
factory for exact correlation.
18
V
V
DDA_OSC_
DDA_ADC
V
V
V
V
V
V
V
Signal
Name
DD_IO
DD_IO
DD_IO
DD_IO
DD_IO
DD_IO
DD_IO
PLL
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA
No.
134
114
Pin
16
31
42
77
96
92
1
Ball No.
C14
K10
F11
K13
F4
K5
E5
K7
E9
Supply
Supply
Supply
Type
56F8367 Technical Data, Rev. 9
During
Reset
State
I/O Power — This pin supplies 3.3V power to the chip I/O
interface and also the Processor core through the on-chip voltage
regulator, if it is enabled.
ADC Power — This pin supplies 3.3V power to the ADC modules.
It must be connected to a clean analog power supply.
Oscillator and PLL Power — This pin supplies 3.3V power to the
OSC and to the internal regulator that in turn supplies the Phase
Locked Loop. It must be connected to a clean analog power
supply.
Signal Description
Freescale Semiconductor
Preliminary

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