MC56F8367VPYE Freescale Semiconductor, MC56F8367VPYE Datasheet - Page 147

• Manufacturer Part Number: MC56F8367VPYE
• Description: IC DSP 16BIT 60MHZ 160-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8367VPYE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 76
• Program Memory Size: 544KB (272K x 16)
• Program Memory Type: FLASH
• Ram Size: 18K x 16
• Voltage - Supply (vcc/vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 160-LQFP
• Cpu Family: 56F8xxx
• Device Core Size: 16b
• Frequency (max): 60MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 36KB
• # I/os (max): 76
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 4(4-chx12-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 160
• Package Type: LQFP
• Data Bus Width: 16 bit
• Processor Series: MC56F83xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 60 MIPs
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 76
• Data Ram Size: 36 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MC56F8367EVME
• Minimum Operating Temperature: - 40 C
• Package: 160LQFP
• Family Name: 56F8xxx
• Maximum Speed: 60 MHz
• Number Of Timers: 4
• For Use With: MC56F8367EVME - EVAL BOARD FOR MC56F83X
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

10.4 Flash Memory Characteristics
10.5 External Clock Operation Timing
Freescale Semiconductor
Preliminary
1. There is additional overhead which is part of the programming sequence. See the 56F8300 Peripheral User Manual
2. Specifies page erase time. There are 512 bytes per page in the Data and Boot Flash memories. The Program Flash
1. Parameters listed are guaranteed by design.
2. See
3. The high or low pulse width must be no smaller than 8.0ns or the chip will not function.
4. External clock input rise time is measured from 10% to 90%.
5. External clock input fall time is measured from 90% to 10%.
Characteristic
Program time
Erase time
Mass erase time
Frequency of operation (external clock driver)
Clock Pulse Width
External clock input rise time
External clock input fall time
for details. Program time is per 16-bit word in Flash memory. Two words at a time can be programmed within the Pro-
gram Flash Module, as it contains two interleaved memories.
Module uses two interleaved Flash memories, increasing the effective page size to 1024 bytes.
Figure 10-4
Data Invalid State
2
1
Data1 Valid
Table 10-13 External Clock Operation Timing Requirements
Data1
Characteristic
for details on using the recommended connection of an external clock driver.
3
Data Active
5
4
Table 10-12 Flash Timing Parameters
Figure 10-3 Signal States
56F8367 Technical Data, Rev. 9
Data2 Valid
Symbol
T
T
Data2
T
erase
prog
2
me
f
t
t
t
Symbol
osc
PW
rise
fall
Min
100
20
20
Tri-stated
Min
3.0
Data
—
—
0
Typ
—
—
—
Typ
—
—
—
—
Data3 Valid
Data Active
Data3
Max
—
—
—
Flash Memory Characteristics
Max
120
10
10
—
1
MHz
Unit
Unit
ms
ms
μs
ns
ns
ns
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